This week our colleagues Diego Kuderna Melgar, Manuel Rueß and Dominik Koch attended the IEEE Southern Power Electronics Conference (SPEC) 2025 in Johannesburg, South Africa. We contributed three papers covering GaN-based power electronics, as well as the use of neural networks for junction temperature estimation in SiC inverters:
- A 2 kW GaN-Based 100 V Half-Bridge Power Module using an optimized PCB-Ceramic Stack-Up for High Efficiency and Power Density
- Electrical and Thermal Characterization of PCB-Embedded 650 V GaN Half-Bridges on AlN Substrates
- Thermally-Informed Neural Networks for Junction Temperature Estimation in SiC-Based Automotive Three-Phase Inverters
Many thanks to everyone who attended our presentations and contributed to the valuable technical discussions!
