We are pleased to share that our institute was represented at the Anniversary World Congress on Biosensors 2025, with a poster presentation entitled “Adaptive Photonic and Microfluidic Chip Packaging via 3D Alignment Structures.”
This work is the result of a collaborative effort between our institute and Michael Heymann’s group - Intelligent Biointegrative Systems. The project explores innovative strategies for packaging photonic and microfluidic chips using 3D-printed alignment structures to enable adaptive, high-precision integration. This approach supports the development of compact, scalable biosensor systems.
Poster presentation “Adaptive Photonic and Microfluidic Chip Packaging via 3D Alignment Structures.”